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Available on Tape and
Reel for Pick and Place
Manufacturing.
Model BD4859N5050AHF
Rev A
Mounting Configuration:
In order for Xinger surface mount components to work optimally, the proper impedance transmission lines must be
used to connect to the RF ports. If this condition is not satisfied, insertion loss, Isolation and VSWR may not meet
published specifications.
All of the Xinger components are constructed from ceramic filled PTFE composites which possess excellent electrical
and mechanical stability having X and Y thermal coefficient of expansion (CTE) of 17 ppm/
o
C.
An example of the PCB footprint used in the testing of these parts is shown below. An example of a DC-biased
footprint is also shown below. In specific designs, the transmission line widths need to be adjusted to the unique
dielectric coefficients and thicknesses as well as varying pick and place equipment tolerances
With No DC Bias
With DC Bias
Solder Resist
Footprint Pad (s)
Circuit Pattern
Dimensions are in Inches [Millimeters]
Mounting Footprint
Plated thru
hole to
ground
3X Transmission
Line
.020 [0.51]
.014 [0.36]
.008 [0.20]
3X
.011 [0.28]
SQ
Plated thru
hole to
ground
3X Transmission
Line
3X .011
[0.28]
3X .011
[0.28]
.020
[0.51]
.014 [0.36]
.008 [0.20]
.008 [0.20]
Solder Resist
Footprint Pad (s)
Circuit Pattern
Dimensions are in Inches [Millimeters]
.020 [0.51]
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